Equipment
- In- Situ Algnment Wafer Bonding System
- Four Point Probe Resistivity measurement system
- Direct Write Lithography System
- Wafer Grinding , Lapping & Polishing System
- Acoustic Scanning Microscope for MEMS
- Thin Film measurement System
- Wire Bonders
- Single , Double and IR Mask Aligners
- Non Contact Depth Measuring Microscope & Zoom Microscope
Wire Bonders
Wafer Cutting Machine
E-Beam & Thermal Evaporator
Thin Film Measurement System
Flip Chip Bonder
Mask Aligner System
Mask Aligner System
Plasma Cleaner System
E Beam Depostion System
Four Point Probe Restivity Measurement System